差分晶振156.25MHz LVDS规格书及使用说明

差分晶振156.25MHz LVDS规格书及使用说明如下:

PRODUCT TYPE(产品类型): SMD LVDS CXO

DIMENSIONS(尺寸)3.2mm*2.5mm

NOMINAL FREQ.(标称频率): 156.25MHz

TXC P/N(TXC 料号): DFA5600007

  • ELECTRICAL SPECIFICATIONS(差分晶振156.25MHz LVDS电气参数)

差分晶振156.25MHz LVDS规格书及使用说明

Note1 Inclusive of frequency tolerance at 25degC, variation over temperature, supply voltage variation, aging and vibration.

Note2 Output will be enable if OE is Logic 1 or open; Output will be disable if OE is Logic 0.

Note3 The standard testing environment except temperature test is 25±5degC,40%~70% relative humidity.

  • TESTING CIRCUIT(差分晶振156.25MHz LVDS测试电路)

差分晶振156.25MHz LVDS规格书及使用说明

Testing Circuit Note (差分晶振156.25MHz LVDS测试电路注意事项)

1) Above testing circuits cover all the specifications except temperature test & Jitter measurement.

2) All the testing equipments are 50Ohm terminal.

3) OE terminal is open connection except OE function test.

  • WAVEFORM CONDITONS(差分晶振156.25MHz LVDS波形图示)

差分晶振156.25MHz LVDS规格书及使用说明

  • DIMENSIONS(差分晶振156.25MHz LVDS尺寸)

差分晶振156.25MHz LVDS规格书及使用说明

  • SUGGESTED REFLOW PROFILE(差分晶振156.25MHz LVDS回流焊作业建议)

差分晶振156.25MHz LVDS规格书及使用说明

Note 1: Period while temperature exceeds the solder melting point : 220℃ should be less than 200 sec.

Note 2: Period while temperature stays at the top melting point : 260℃ should be less than 30 sec

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