TXC 8Y24000028 晶振SMD2016 24MHz规格说明

TXC 8Y24000028 晶振SMD2016 24MHz规格说明,如下:

标准测试条件Standard atmospheric conditions

If there is any doubt about the results, measurement shall be made within the following limits:

环境温度Ambient temperature: 25±3℃

相对湿度Relative humidity: 40%~70%

石英切型Crystal cutting type

The crystal is using AT CUT (thickness shear mode).

晶振单体重量Unit Weight: 0.005±0.002 g/pcs

测试设备Measure equipment

Electrical characteristics measured by S&A250B or equivalent.

TXC 8Y24000028 晶振SMD2016 24MHz MAIN ELECTRICAL SPECIFICATIONS主要电气参数

  • 标称频率 Nominal Frequency: 24.000000MHz
  • 封装类型 Holder Type: SMD 2.0*1.6
  • 振动模式 Vibration Mode:  Fundamental(基频)
  • 调整频差 Frequency Tolerance(+25℃): ±10 ppm
  • 频率稳定度 Frequency Stability: ±15 ppm (Over Operating Temp. Range (Reference 25℃)
  • 工作温度范围 Operating Temperature Range: -40 to +85℃
  • 等效电阻 Equivalent Series Resistance : 50 ohms.
  • 静电容 Shunt Capacitance(C0): 3pF Maximum
  • 负载电容 Load Capacitance: 9pF
  • 激励功率 Drive Level:  100 μw
  • 绝缘阻抗Insulation Resistance: 500M ohms. (at DC 100V)
  • 年老化率 Aging Rate a year: ≤±1 ppm (1st Year)

TXC 8Y24000028 晶振SMD2016 24MHz PARAMETERS AND ELECTRICAL SPECIFICATIONS电气参数详情

TXC 8Y24000028 晶振SMD2016 24MHz规格说明

TXC 8Y24000028 晶振SMD2016 24MHz DIMENSIONS AND PADS尺寸及焊盘说明

TXC 8Y24000028 晶振SMD2016 24MHz规格说明

TXC 8Y24000028 晶振SMD2016 24MHz回流焊及手焊说明SUGGESTED REFLOW AND MANUAL SOILDER CONDITIONS

TXC 8Y24000028 晶振SMD2016 24MHz规格说明

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