石英晶体谐振器HC-49SMD封装回流焊作业注意事项

Some Precautions for SMT Flowing Conditions of Our HC-49SMD Crystal Products石英晶体谐振器HC-49SMD回流焊作业注意事项

1、 Reflow Condition(回流焊条件)

Please Strictly stay with our proposed reflow condition below and do soldering 2 times max.
请严格遵循我司以下回流焊作业建议,且回流焊次数不可超过2次。

Peak(焊接温度):260±5℃

Time(焊接时间):10 seconds

石英晶体谐振器HC-49SMD封装回流焊作业注意事项

2、 Soldering materials should be used within the validity period in case it cause any disconnections or drop issues.
相关焊接材料需要在有效期内使用,以防造成虚焊或脱落问题。

石英晶体谐振器HC-49SMD封装回流焊作业注意事项

3、 We highly recommend our products be used soon after they are unpacked incase any pad oxidation occurs.
我们强烈建议我们的产品在拆开包装后立即使用,以防焊盘发生氧化。

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